# ASIC III – Amz010066 at Amazon Leo

- Company: Amazon Leo
- What the company does: Experience high speed satellite internet service with Amazon Leo. Stream 4K videos, make seamless video calls, and stay connected anywhere in the world. Backed by Space Capital.
- Company website: https://leo.amazon.com
- Type: Startups
- Level: Mid level
- Location: Austin, Texas, USA
- Work setup: On-site
- Pay: $203K to $215K base salary per year (USD)
- Posted: 2026-11-06
- Apply by: 2026-12-21
- Apply: https://www.amazon.jobs/en/jobs/10598800/asic-iii-amz010066?utm_source=1752vc&utm_medium=careers
- Page: https://www.1752.vc/careers/jobs/amazon-leo-asic-iii-amz010066/

## About the role

Design and validate high-bandwidth memory and DDR memory physical layer interfaces for machine learning accelerator chips and system-on-chip architectures. Integrate third-party intellectual property blocks into complex system-on-chip designs and perform advanced 2.5D packaging design for memory subsystems. Perform post-silicon validation and characterization of memory subsystems including bring-up, debug, and performance optimization. Found on 1752vc Careers, the job board for startup and VC roles.

Tags: Corporate Operations

Source: 1752vc Careers, https://www.1752.vc/careers/jobs/amazon-leo-asic-iii-amz010066/