# Package Layout Design Engineer , Annapurna Labs - AI Silicon Packaging at Amazon

- Company: Amazon
- What the company does: Backed by Kleiner Perkins and Madrona.
- Company website: http://www.amazon.com/
- Type: Startups (AI role)
- Level: Mid level
- Location: Tempe, Arizona, USA
- Work setup: On-site
- Posted: 2026-09-30
- Apply by: 2026-11-14
- Apply: https://www.amazon.jobs/en/jobs/10565145/package-layout-design-engineer-annapurna-labs-ai-silicon-packaging
- Page: https://www.1752.vc/careers/jobs/amazon-package-layout-design-engineer-annapurna-labs-ai-silicon-packaging/

## About the role

We are seeking a Package Layout Design Engineer to join our hardware team and contribute to the physical design of advanced IC packages for next-generation machine learning and data center ASICs. In this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets.

Tags: Hardware Development