# Sr. Thermal & Mechanical Packaging Engineer, Annapurna Labs at Amazon

- Company: Amazon
- What the company does: Backed by Kleiner Perkins and Madrona.
- Company website: http://www.amazon.com/
- Type: Startups
- Level: Senior
- Location: Austin, Texas, USA
- Work setup: On-site
- Posted: 2026-09-29
- Apply by: 2026-11-13
- Apply: https://www.amazon.jobs/en/jobs/10564208/sr-thermal-mechanical-packaging-engineer-annapurna-labs
- Page: https://www.1752.vc/careers/jobs/amazon-sr-thermal-and-mechanical-packaging-engineer-annapurna-labs/

## About the role

As a member of the Machine Learning Acceleration team you’ll be responsible for the design and optimization of hardware in our data centers. You’ll provide leadership in the application of new technologies to large scale server deployments in a continuous effort to deliver a world-class customer experience. This is a fast-paced, intellectually challenging position, and you’ll work with thought leaders in multiple technology areas.

Tags: Hardware Development