# Principal Advanced Packaging Engineer at Astera Labs

- Company: Astera Labs
- What the company does: Astera Labs: Purpose-Built Connectivity for Rack-Scale AI.
- Company website: https://www.asteralabs.com
- Type: Startups
- Level: Principal and up
- Location: San Jose, California, United States
- Work setup: On-site
- Pay: $205K to $260K base salary per year (USD)
- Posted: 2026-09-14
- Apply by: 2026-10-29
- Apply: https://job-boards.greenhouse.io/asteralabs/jobs/4733678005
- Page: https://www.1752.vc/careers/jobs/astera-labs-principal-advanced-packaging-engineer/

## About the role

Astera Labs is seeking a Principal Advanced Packaging Engineer to lead R&D for next-generation packaging technologies for optical chips. This is a senior individual contributor role focused on setting technical direction and driving packaging technology development for NPO and CPO products.

## What they're looking for

- B.S., M.S., or Ph.D. in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field
- 8+ years of experience in semiconductor or advanced packaging engineering, with demonstrated technical leadership
- Deep expertise in advanced packaging processes, including 2.5D/3D integration, flip-chip, hybrid bonding, Cu pillar, TSV, RDL, and overmold across wafer-, panel-, and die-level flows
- Experience with silicon photonics chip packaging and EIC/PIC integration
- Hands-on experience with advanced packaging materials, including underfill, molding compounds, dielectrics, adhesives, or optical-grade encapsulants
- Proven track record of equipment and process qualification with OSAT or tool suppliers

Tags: Design Engineering CCE1