# Technical Lead Package Platform Engineer at Astera Labs

- Company: Astera Labs
- What the company does: Astera Labs: Purpose-Built Connectivity for Rack-Scale AI.
- Company website: https://www.asteralabs.com
- Type: Startups
- Level: Senior
- Location: San Jose, California, United States
- Work setup: On-site
- Pay: $160K to $200K base salary per year (USD)
- Posted: 2026-08-21
- Apply by: 2026-10-12
- Apply: https://job-boards.greenhouse.io/asteralabs/jobs/4726749005
- Page: https://www.1752.vc/careers/jobs/astera-labs-technical-lead-package-platform-engineer/

## About the role

We are seeking a L ead Package Engineer to drive the development, qualification, and manufacturing of advanced FCBGA packages. This role will drive package development from concept through NPI, qualification, and high-volume manufacturing, with strong ownership of technical execution, supplier management, project management, and package-related customer quality issues.

## What they're looking for

- Bachelor's degree or higher in a related field
- Minimum of 5 years of professional experience in electronic packaging fields
- Strong experience in FCBGA assembly manufacturing processes and laminate substrate technologies
- Proven NPI development experience for advanced flip-chip packages, from early package definition through qualification and production release
- Experience with package implementation from die netlist to flip-chip package design and manufacturing
- Demonstrated experience managing substrate suppliers and assembly OSAT partners

Tags: Packaging