# ASIC Package Design Engineer at Broadcom

- Company: Broadcom
- What the company does: Broadcom delivers semiconductors and infrastructure software for global enterprises’ most complex, mission-critical needs.
- Company website: https://www.broadcom.com
- Type: Startups
- Level: Mid level
- Location: 3 Locations
- Work setup: On-site
- Posted: 2026-10-19
- Apply by: 2026-12-03
- Apply: https://broadcom.wd1.myworkdayjobs.com/en-US/external_career/job/USA-CA-San-Jose-Innovation-Drive/ASIC-Package-Design-Engineer_R027439?utm_source=1752vc&utm_medium=careers
- Page: https://www.1752.vc/careers/jobs/broadcom-asic-package-design-engineer/

## About the role

1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Found on 1752vc Careers, the job board for startup and VC roles.

## What they're looking for

- BSEE or similar field and 12+ years’ experience in flip-chip-BGA package design, including high-speed SerDes or MSEE or similar field and 10+ years’ work experience
- Knowledge of package-level signal integrity and power integrity, to apply to package designs
- Cadence APD (allegro package designer) experience is preferred. Equivalent tool is OK
- Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers
- Self-management and organization skills
- Preferred candidates will also have 1 or more years experience with Cadence SKILL for Allegro, or similar design-automation coding experience and interest


Source: 1752vc Careers, https://www.1752.vc/careers/jobs/broadcom-asic-package-design-engineer/