# Package Design Engineer at Broadcom

- Company: Broadcom
- What the company does: Broadcom delivers semiconductors and infrastructure software for global enterprises’ most complex, mission-critical needs.
- Company website: https://www.broadcom.com
- Type: Startups
- Level: Mid level
- Location: 3 Locations
- Work setup: On-site
- Posted: 2026-09-08
- Apply by: 2026-10-23
- Apply: https://broadcom.wd1.myworkdayjobs.com/en-US/external_career/job/USA-CA-San-Jose-Innovation-Drive/Package-Design-Engineer_R027028-3
- Page: https://www.1752.vc/careers/jobs/broadcom-package-design-engineer/

## About the role

Overall design responsibility for ASIC package designs, including aspects of signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts. Package Design of critical structures for SerDes, ADC/DAC, DDR, etc.

## What they're looking for

- BSEE or similar field and 2+ years’ experience in flip-chip-BGA package design, including high-speed SerDes or MSEE or PhD
- Knowledge of electrical engineering fundamentals
- Preferred candidates have a working knowledge of package-level signal integrity and power integrity, to apply to package designs
- Cadence APD (allegro package designer) experience is preferred. Equivalent layout tool is OK
- Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers
- Self-management and organization skills


Source: 1752vc Careers, https://www.1752.vc/careers/jobs/broadcom-package-design-engineer/