# Principal Die-to-Die Interconnect Modeling Architect at Broadcom

- Company: Broadcom
- What the company does: Broadcom delivers semiconductors and infrastructure software for global enterprises’ most complex, mission-critical needs.
- Company website: https://www.broadcom.com
- Type: Startups
- Level: Principal and up
- Location: 2 Locations
- Work setup: On-site
- Posted: 2026-10-08
- Apply by: 2026-11-22
- Apply: https://broadcom.wd1.myworkdayjobs.com/en-US/external_career/job/USA-CA-San-Jose-Innovation-Drive/Principal-Die-to-Die-Interconnect-Modeling-Architect_R027227?utm_source=1752vc&utm_medium=careers
- Page: https://www.1752.vc/careers/jobs/broadcom-principal-die-to-die-interconnect-modeling-architect/

## About the role

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## What they're looking for

- Develop comprehensive behavioral and architectural models that accurately predict complete link behavior before implementation
- Build system-level models using MATLAB, Python, SystemC, or equivalent modeling environments
- Model transmitter, receiver, package, channel, clocking, equalization, adaptation, and protocol interactions
- Predict link performance including BER, latency, throughput, bandwidth density, power consumption, energy efficiency, and manufacturing margin
- Perform architectural sensitivity analyses across process, voltage, temperature (PVT), aging, package variation, jitter, noise, and channel impairments
- Apply communication theory to help develop robust, high-performance signaling architectures


Source: 1752vc Careers, https://www.1752.vc/careers/jobs/broadcom-principal-die-to-die-interconnect-modeling-architect/