# Solutions Engineer - AE at Cadence

- Company: Cadence
- What the company does: Cadence delivers remote patient monitoring and chronic disease management that improves outcomes and reduces cost at scale. Intelligent senior care that works better by working ahead. Backed by General Catalyst.
- Company website: https://www.cadence.care/
- Type: Startups
- Level: Mid level
- Location: No Seat Req United States
- Work setup: On-site
- Pay: $162K to $302K base salary per year (USD)
- Posted: 2026-10-22
- Apply by: 2026-12-06
- Apply: https://cadence.wd1.myworkdayjobs.com/en-US/External_Careers/job/No-Seat-Req-United-States/Solutions-Engineer---AE_R56940?utm_source=1752vc&utm_medium=careers
- Page: https://www.1752.vc/careers/jobs/cadence-solutions-engineer-ae/

## About the role

Cadence is seeking a highly motivated and experienced Solutions Application Engineer to support customers developing next-generation advanced packaging solutions, including 2.5D, 3D-IC, chiplet-based architectures, AI/HPC packages, and heterogeneous integration technologies. Found on 1752vc Careers, the job board for startup and VC roles.

## What they're looking for

- Bachelor’s degree (Masters preferred) in Electrical or Electronics Engineering, or related discipline with
- 10+ years of experience in semiconductor packaging, IC packaging, PCB, substrate, or interposer design
- Strong knowledge of: Advanced package design methodologies
- 2.5D and 3D-IC integration
- Chiplet-based architectures
- Package manufacturing and assembly processes


Source: 1752vc Careers, https://www.1752.vc/careers/jobs/cadence-solutions-engineer-ae/