# Advanced Packaging Layout Engineering Team Leader (Substrate & Interposer) (Hybrid) at Cisco

- Company: Cisco
- What the company does: Cisco is a worldwide technology leader powering an inclusive future for all. Learn more about our products, services, solutions, and innovations. Backed by Sequoia and Menlo.
- Company website: https://www.cisco.com/
- Type: Startups
- Level: Mid level
- Location: San Jose, California, US
- Work setup: On-site
- Posted: 2026-10-26
- Apply by: 2026-12-10
- Apply: https://cisco.wd5.myworkdayjobs.com/en-US/Cisco_Careers/job/San-Jose-California-US/Advanced-Packaging-Layout-Engineering-Team-Leader--Substrate---Interposer---Hybrid-_2029516?utm_source=1752vc&utm_medium=careers
- Page: https://www.1752.vc/careers/jobs/cisco-advanced-packaging-layout-engineering-team-leader-substrate-and-interposer/

## About the role

As a Packaging Layout Team Leader, you will lead and grow the San Jose layout team while supporting the execution of complex package programs. You will provide hands-on technical guidance, mentorship, resource coordination, and people leadership for package layout activities across advanced ASIC packaging and CoWoS projects. Found on 1752vc Careers, the job board for startup and VC roles.

## What they're looking for

- 5+ years of experience in package layout or advanced PCB/package implementation
- Prior experience working with high‑speed routing, power distribution networks (PDN), and package layout design principles
- Experience with industry‑standard EDA tools for package layout and design
- Hands-on experience with Cadence APD+ or equivalent package layout tools


Source: 1752vc Careers, https://www.1752.vc/careers/jobs/cisco-advanced-packaging-layout-engineering-team-leader-substrate-and-interposer/