# Package Layout Engineer at Density

- Company: Density
- What the company does: Density shows you how people use your space and helps you get more out of every square foot. Backed by Kleiner Perkins and South Park Commons.
- Company website: https://www.density.io/
- Type: Startups (AI role)
- Level: Mid level
- Location: Mountain View, CA
- Work setup: On-site
- Posted: 2026-08-06
- Apply by: 2026-10-08
- Apply: https://job-boards.greenhouse.io/densityai/jobs/4354890009
- Page: https://www.1752.vc/careers/jobs/density-package-layout-engineer/

## About the role

Own the physical layout of the advanced packages our AI accelerator silicon ships in. You'll take multi-die 2.5D and 3D packages from bump map through tapeout release — defining substrate and interposer stackups, planning bump and ball maps against the die floorplan, routing high-density escape and HBM-class channels, and building the power delivery that feeds hundreds of amps into the accelerator.

## What they're looking for

- 8+ years of package layout experience on high-performance designs, including 2.5D / 3D and multi-die packages (CoWoS, EMIB, InFO, fan-out, or equivalent interposer technologies)
- Hands-on with industry-standard package layout tools (Cadence Allegro Package Designer / SiP Layout, Siemens Xpedition Package Designer, or equivalent) and package DRC/LVS flows
- Demonstrated ability to work closely with architecture, physical design, SI/PI, thermo-mechanical, and OSAT partners to converge and sign off complex package designs

Tags: Hardware