# Substrate IC Package Layout Design Engineer at Etched

- Company: Etched
- What the company does: Co-designed chips, racks, and software to push the pareto frontier to best-in-class throughput and interactivity. Backed by Kleiner Perkins and Sequoia.
- Company website: https://www.etched.com/
- Type: Startups
- Level: Mid level
- Location: San Jose
- Work setup: On-site
- Posted: 2026-08-27
- Apply by: 2026-10-11
- Apply: https://jobs.ashbyhq.com/etched/4e770111-c9c1-457d-8530-c3dd28971b3a
- Page: https://www.1752.vc/careers/jobs/etched-substrate-ic-package-layout-design-engineer/

## About the role

Lead the design and development of complex IC substrate layouts for high-power AI processors and accelerators. Design large (>50mm) and complex multi-layer substrate packages with high pin counts and dense routing requirements.

## What they're looking for

- Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field
- 10+ years of experience in IC substrate layout design for high-performance processors or accelerators
- Extensive experience with large substrate packages (>50mm) and complex high-density layouts
- Proven experience with high-power (700W+) package designs and robust power delivery networks
- Expertise in high-speed signaling design (>50GHz) and mitigating signal integrity challenges (crosstalk, reflections, impedance mismatches)
- Strong experience with CoWoS (Chip-on-Wafer-on-Substrate) interposer design and the impact of the substrate design to support CoWos

Tags: Architecture