# Wafer Bonding Process Engineer, Quantum AI at Google

- Company: Google
- What the company does: Learn more about Google. Explore our innovative AI products and services, and how we. Backed by Kleiner Perkins.
- Company website: https://about.google/
- Type: Startups (AI role)
- Level: Mid level
- Location: United States
- Work setup: On-site
- Posted: 2026-11-04
- Apply by: 2026-12-19
- Apply: https://www.google.com/about/careers/applications/jobs/results/137052634371498694-wafer-bonding-process-engineer-quantum-ai?utm_source=1752vc&utm_medium=careers
- Page: https://www.1752.vc/careers/jobs/google-wafer-bonding-process-engineer-quantum-ai/

## About the role

In this role, you will lead the development, integration, and Release to Production of temporary wafer bonding, thinning, and debonding (TB/DB) processes for Google Quantum AI’s next-generation quantum processors. Responsibilities include developing and implementing process flows featuring advanced adhesive bonding chemistries, manufacturable debonding systems, and thin-wafer handling. Found on 1752vc Careers, the job board for startup and VC roles.

## What they're looking for

- Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience
- 3 years of experience developing, sustaining, or integrating semiconductor fabrication processes in an research and development (R&D) or cleanroom production environment
- 3 years of experience in temporary wafer bonding, laser/thermal debonding, thin wafer handling, or back-end packaging processes


Source: 1752vc Careers, https://www.1752.vc/careers/jobs/google-wafer-bonding-process-engineer-quantum-ai/