# Principal ASIC Package Design Engineer at K2 Space

- Company: K2 Space
- What the company does: Building the largest satellites in orbit. Ultra-powerful, scalable platforms engineered for LEO, MEO, GEO and cislunar missions. Explore the next-generation of satellites. Backed by Kleiner Perkins, First Round and ICONIQ.
- Company website: https://www.k2space.com/#
- Type: Startups
- Level: Principal and up
- Location: Seattle, WA
- Work setup: On-site
- Pay: $200K to $280K base salary per year (USD)
- Posted: 2026-09-15
- Apply by: 2026-10-30
- Apply: https://job-boards.greenhouse.io/k2spacecorporation/jobs/5425326008
- Page: https://www.1752.vc/careers/jobs/k2-space-principal-asic-package-design-engineer-2/

## About the role

With multiple launches in 2027 and plans to scale to 100 satellites a year, we're Building Bigger — helping develop the solar system and build toward a Kardashev Type II (K2) civilization. If you are a motivated individual who thrives in a fast-paced environment and you're excited about contributing to the success of a high-growth Series D-funded company, we'd love for you to apply.

## What they're looking for

- Own ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints
- Lead package-level trade studies across cost, performance, power integrity (PI), signal integrity (SI), thermal, manufacturability, and reliability
- Define long-term packaging roadmap aligned with future ASIC nodes, bandwidth scaling, and multi-die integration
- Establish organizational package design standards, methodologies, and best practices
- Drive detailed design of FC-BGA packages for high-pin-count ASICs with high-speed SerDes, dense power grids, and RF signal content
- Define and review substrate stack-ups, via strategies, impedance control, escape routing, and reference plane planning

Tags: Silicon