# Advanced Package Technology Principal Engineer at Lumilens

- Company: Lumilens
- What the company does: Backed by Redpoint.
- Company website: https://lumilens.com/
- Type: Startups
- Level: Principal and up
- Location: San Jose
- Work setup: On-site
- Posted: 2026-03-22
- Apply by: 2026-10-08
- Apply: https://jobs.ashbyhq.com/lumilens/c27b8117-cf61-4ea4-aae6-745a916acceb
- Page: https://www.1752.vc/careers/jobs/lumilens-advanced-package-technology-principal-engineer/

## About the role

At Lumilens, we are redefining the optical layer that powers tomorrow’s AI and high‑performance computing. We are seeking an experienced IC Package Mechanical FEA Engineer to help drive the next generation of high‑performance packaging solutions for advanced ASICs.

## What they're looking for

- Bachelor’s in Mechanical Engineering (or related field) with 12+ years FEA experience, Master’s with 10+, or PhD with 7+
- Deep expertise in advanced packaging technologies, including flip‑chip, FOWLP, 2.5D/3D integration, chiplet architectures, and TSVs
- Strong understanding of materials behavior across polymers, metals, ceramics, and their thermo‑mechanical interactions
- Familiarity with semiconductor packaging processes such as die attach, underfill, molding, bumping, and reflow
- Proficiency with FEA tools, including Ansys Classic/Mechanical and Abaqus
- Ability to interpret and correlate complex simulation results using first‑principles mechanical engineering concepts

Tags: Engineering