# Director, APTD Die Level Technology Process Development at Micron Technology

- Company: Micron Technology
- What the company does: Micron is a global leader in memory and storage, powering AI and compute-intensive applications from cloud to edge with innovative semiconductor solutions.
- Company website: https://www.micron.com
- Type: Startups
- Level: Principal and up
- Location: Boise, ID - Main Site
- Work setup: On-site
- Posted: 2026-11-04
- Apply by: 2026-12-19
- Apply: https://micron.wd1.myworkdayjobs.com/en-US/External/job/Boise-ID---Main-Site/DMTS-Process-Development-Engineer--Advanced-Packaging_JR112474?utm_source=1752vc&utm_medium=careers
- Page: https://www.1752.vc/careers/jobs/micron-technology-director-aptd-die-level-technology-process-development/

## About the role

We are seeking an experienced organizational leader who will lead and influence methodology improvements, including best practices in process development, data-driven decision-making, and application of AI/advanced analytics to drive innovation. In this role, you will drive strategic process development for Micron’s most advanced memory products, including HBM, 3DS DRAM, and emerging 3D architectures. Found on 1752vc Careers, the job board for startup and VC roles.

## What they're looking for

- MS in Chemistry, Chemical Engineering, Materials Science, or related field (or equivalent experience)
- 15+ years in semiconductor process development, manufacturing, or advanced packaging
- Deep expertise in wafer‑level or die‑level processes such as CMP, etch, cleans, thin films, lithography, hybrid bonding, TCB, dicing, or molding
- Strong understanding of semiconductor process integration and materials interactions
- Proven experience leading complex cross‑functional technical programs


Source: 1752vc Careers, https://www.1752.vc/careers/jobs/micron-technology-director-aptd-die-level-technology-process-development/