# Intern - Advanced Packaging TD at Micron Technology

- Company: Micron Technology
- What the company does: Micron is a global leader in memory and storage, powering AI and compute-intensive applications from cloud to edge with innovative semiconductor solutions.
- Company website: https://www.micron.com
- Type: Startups
- Level: Internship
- Location: Boise, ID - Main Site
- Work setup: On-site
- Posted: 2026-11-03
- Apply by: 2026-12-18
- Apply: https://micron.wd1.myworkdayjobs.com/en-US/External/job/Boise-ID---Main-Site/Intern---Advanced-Packaging-TD_JR115368?utm_source=1752vc&utm_medium=careers
- Page: https://www.1752.vc/careers/jobs/micron-technology-intern-advanced-packaging-td/

## About the role

Join Micron’s Advanced Packaging Technology Development (TD) team, where innovation and precision come together to develop next-generation interconnect technologies. The team develops solutions designed to improve semiconductor performance, reliability, and advanced packaging capabilities. Found on 1752vc Careers, the job board for startup and VC roles.

## What they're looking for

- Currently enrolled in an accredited university pursuing a Master’s degree or PhD in a semiconductor-related field, with an expected graduation date no earlier than Fall 2027 and no later than Summer 2028
- Demonstrated experience with data extraction, statistical analysis, and technical reporting using tools such as JMP or comparable analytics tools
- Demonstrated ability to collaborate and communicate technical findings across multi-functional teams
- Ability to prioritize multiple technical projects, adapt to changing responsibilities, and deliver results within project timelines and resource constraints
- Experience Using AI, Code Assist, or Agent-based solutions for technical analysis, engineering workflows, or related applications


Source: 1752vc Careers, https://www.1752.vc/careers/jobs/micron-technology-intern-advanced-packaging-td/