# Intern - System Engineer, HBM at Micron Technology

- Company: Micron Technology
- What the company does: Micron is a global leader in memory and storage, powering AI and compute-intensive applications from cloud to edge with innovative semiconductor solutions.
- Company website: https://www.micron.com
- Type: Startups
- Level: Internship
- Location: Boise, ID - Main Site
- Work setup: On-site
- Posted: 2026-11-02
- Apply by: 2026-12-17
- Apply: https://micron.wd1.myworkdayjobs.com/en-US/External/job/Boise-ID---Main-Site/Intern---System-Engineer--HBM_JR113469?utm_source=1752vc&utm_medium=careers
- Page: https://www.1752.vc/careers/jobs/micron-technology-intern-system-engineer-hbm/

## About the role

As a High Bandwidth Memory (HBM) Product & System Engineering Intern, you will contribute to the validation and optimization of Micron’s HBM products —the fastest and highest-capacity HBM available. You’ll work alongside experienced engineers to develop innovative solutions for testing and integrating HBM into customer platforms, helping advance generative AI and high-performance computing. Found on 1752vc Careers, the job board for startup and VC roles.

## What they're looking for

- Enrolled in a Bachelor’s or Master’s program or equivalent experience in Electrical or Computer Engineering. Graduation date must be after September 2027
- Strong understanding of computer architecture, memory systems, and memory technologies
- Proficiency in Python, C/C++, and scripting for debugging and testing
- Excellent problem-solving and analytical skills
- Enthusiastic teammate with strong communication skills and a proactive approach


Source: 1752vc Careers, https://www.1752.vc/careers/jobs/micron-technology-intern-system-engineer-hbm/