# MTS Process Integration Engineer | APTD Die Level Technology at Micron Technology

- Company: Micron Technology
- What the company does: Micron is a global leader in memory and storage, powering AI and compute-intensive applications from cloud to edge with innovative semiconductor solutions.
- Company website: https://www.micron.com
- Type: Startups
- Level: Mid level
- Location: Boise, ID - Main Site
- Work setup: On-site
- Posted: 2026-09-24
- Apply by: 2026-11-08
- Apply: https://micron.wd1.myworkdayjobs.com/en-US/External/job/Boise-ID---Main-Site/MTS-Process-Integration-Engineer---APTD-Die-Level-Technology_JR111451
- Page: https://www.1752.vc/careers/jobs/micron-technology-mts-process-integration-engineer-aptd-die-level-technology/

## About the role

As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions.

## What they're looking for

- Bachelor’s degree in Materials Engineering, Chemical Engineering, or a related field with 8+ years of experience to include advanced packaging technology development, 2.5D, 3D stacking, and HBM integration
- Experience with TSVs, advanced interconnects, die stacking, underfill, molding, bonding, and package integration processes
- Experience with hybrid bonding integration and reliability, including wafer-to-wafer or chip-to-wafer processes
- Experience with HBM and logic integration, including thermal optimization
- Experience supporting cross-functional engineering programs in a fast-paced development environment


Source: 1752vc Careers, https://www.1752.vc/careers/jobs/micron-technology-mts-process-integration-engineer-aptd-die-level-technology/