# New College Grad - Mixed Signal Design Engineer, HBM at Micron Technology

- Company: Micron Technology
- What the company does: Micron is a global leader in memory and storage, powering AI and compute-intensive applications from cloud to edge with innovative semiconductor solutions.
- Company website: https://www.micron.com
- Type: Startups
- Level: Mid level
- Location: Richardson, TX
- Work setup: On-site
- Posted: 2026-09-25
- Apply by: 2026-11-09
- Apply: https://micron.wd1.myworkdayjobs.com/en-US/External/job/Richardson-TX/New-College-Grad---Mixed-Signal-Design-Engineer--HBM_JR110753
- Page: https://www.1752.vc/careers/jobs/micron-technology-new-college-grad-mixed-signal-design-engineer-hbm/

## About the role

In this role, y ou'll receive mentorship from expert engineers while building expertise in sophisticated memory technologies. You will also contribute to the definition, implementation, integration, and validation of HBM base-die digital subsystems. You will collaborate with cross-disciplinary engineering groups to develop robust RTL solutions, support verification activities, and help ensure successful first-pass silicon execution.

## What they're looking for

- Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field
- Experience with digital design, SoC integration, or semiconductor development through academic projects, internships, research, or industry experience
- Solid understanding of SystemVerilog RTL development, clock and reset architectures, CDC/RDC methodologies, and low-power design concepts
- Understanding of design-for-debug and design-for-test principles and the ability to collaborate effectively within multi-functional engineering teams
- Experience working in AI-Assisted or AI-Enabled environments, or demonstrated willingness to apply AI tools to support engineering workflows, debug activities, and technical analysis