# Principal Process Engineer, Die Bonding at Micron Technology

- Company: Micron Technology
- What the company does: Micron is a global leader in memory and storage, powering AI and compute-intensive applications from cloud to edge with innovative semiconductor solutions.
- Company website: https://www.micron.com
- Type: Startups
- Level: Principal and up
- Location: Boise, ID - Main Site
- Work setup: On-site
- Posted: 2026-09-24
- Apply by: 2026-11-08
- Apply: https://micron.wd1.myworkdayjobs.com/en-US/External/job/Boise-ID---Main-Site/Principal-Process-Engineer--Die-Bonding_JR100591
- Page: https://www.1752.vc/careers/jobs/micron-technology-principal-process-engineer-die-bonding/

## About the role

As a Principal Process Engineer in Hybrid and Fusion Die Bonding, you will provide technical leadership in the startup, development, qualification, and optimization of advanced die-bonding processes for next-generation semiconductor products. You will apply deep process expertise and data-driven problem solving to improve product quality and reliability, accelerate yield learning, reduce cost, increase productivity, mitigate technical and manufacturing risk, and resolve complex production-line challenges.

## What they're looking for

- A BS degree with minimum 8+ years proven experience in Semiconductor Process Engineering
- Solid engineering knowledge of semiconductor advanced packaging die stacking processes
- Skilled at designing valid tests and Design of Experiments (DOE)
- Excellent data collection, organization, and analysis skills, plus proficiency in data analysis techniques/programs
- Knowledge and an understanding of project management and experience leveraging AI to design experiments


Source: 1752vc Careers, https://www.1752.vc/careers/jobs/micron-technology-principal-process-engineer-die-bonding/