# New Product Introduction Engineer - Thermal at Nexthop AI

- Company: Nexthop AI
- What the company does: Backed by a16z, Kleiner Perkins and Lightspeed.
- Company website: https://nexthop.ai/
- Type: Startups (AI role)
- Level: Mid level
- Location: Santa Clara, California
- Work setup: On-site
- Posted: 2026-07-21
- Apply by: 2026-10-08
- Apply: https://nexthopai.bamboohr.com/careers/98
- Page: https://www.1752.vc/careers/jobs/nexthop-ai-new-product-introduction-engineer-thermal/

## About the role

At Nexthop AI, our thermal solutions are as complex as the silicon they cool. We are looking for a Hardware Product Engineer to act as the ultimate technical authority for our Direct-to-Chip (D2C) and rack-level cooling systems. This role sits within the Hardware Design Ladder and is responsible for the physical realization of our hardware—from the initial equipment selection at the factory to the final data sign-off before a product reaches the customer.

## What they're looking for

- Equipment Buyoff (FAT/SAT): Lead Factory Acceptance Testing (FAT) and Site Acceptance Testing (SAT). You own the "Buyoff" process, ensuring equipment meets precision, repeatability, and safety standards
- Thermal Validation Lead: Identify and establish the "North Star" metrics for D2C and rack-level integration. Define what we measure, how it’s captured at the factory, and why it ensures long-term survival
- NPI Milestone Leadership: Lead technical reviews for EVT/DVT/PVT milestones, ensuring all thermal exit criteria are met and documented
- L10/L11 System Integration: Define the technical requirements for integrating switch chassis into liquid-cooled racks, focusing on manifold reliability and blind-mate coupling integrity
- TIM Strategy: Define and validate Thermal Interface Material (TIM) application and compression standards to prevent pump-out and ensure decade-long thermal stability
- New Technologies : Evaluate and vet emerging cooling technologies—such as two-phase systems or advanced heat siphons—to determine technical and operational fit

Tags: Engr HW