# Director, Package Design Engineering at Renesas Electronics

- Company: Renesas Electronics
- What the company does: Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial,...
- Company website: https://www.renesas.com
- Type: Startups
- Level: Principal and up
- Location: Phoenix, AZ
- Work setup: On-site
- Posted: 2026-09-26
- Apply by: 2026-11-10
- Apply: https://jobs.smartrecruiters.com/RenesasElectronics/744000151979796
- Page: https://www.1752.vc/careers/jobs/renesas-electronics-director-package-design-engineering-2/

## About the role

Are you ready to join our team and shape the future with us?

## What they're looking for

- Doctorate/Masters / Bachelor’s Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering
- 15 to 20 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging
- Strong understanding of power SiP/modules, wafer level/flip-chip packaging methods, assembly process knowledge, qualification methods, SPC and statistical analysis software
- Knowledge of wire-bonding & multi-chip module technologies a plus
- Strong interpersonal and communication skills
- Strong analytical and presentation skills