# Manager, Semiconductor IC Packaging & Assembly Engineering at Renesas Electronics

- Company: Renesas Electronics
- What the company does: Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial,...
- Company website: https://www.renesas.com
- Type: Startups
- Level: Senior
- Location: Shah Alam, MY
- Work setup: On-site
- Posted: 2026-09-14
- Apply by: 2026-10-29
- Apply: https://jobs.smartrecruiters.com/RenesasElectronics/744000149382044
- Page: https://www.1752.vc/careers/jobs/renesas-electronics-manager-semiconductor-ic-packaging-and-assembly-engineering/

## About the role

We are seeking an experienced Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and manufacturing execution for advanced semiconductor packaging technologies.

## What they're looking for

- Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related technical discipline
- 12+ years of semiconductor manufacturing and packaging engineering experience with exposure to IC assembly operations, package development, qualification, and NPI-to-HVM transfers
- 5+ years of experience leading technical projects, coordinating engineering activities, or mentoring engineers in semiconductor manufacturing environments
- Strong understanding of semiconductor manufacturing yield analysis, SPC, DOE, reliability, process control methodologies, package/process qualification methods, and statistical analysis tools
- Experience working with global OSAT partners and outsourced manufacturing ecosystems, including qualification support and ongoing technical coordination with subcontractors and contract manufacturers
- Experience supporting NPI-to-HVM product ramp execution