# Principal Package Design Engineer at Renesas Electronics

- Company: Renesas Electronics
- What the company does: Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial,...
- Company website: https://www.renesas.com
- Type: Startups
- Level: Principal and up
- Location: Tempe, Arizona
- Work setup: On-site
- Posted: 2026-10-19
- Apply by: 2026-12-03
- Apply: https://jobs.smartrecruiters.com/RenesasElectronics/744000156428759?utm_source=1752vc&utm_medium=careers
- Page: https://www.1752.vc/careers/jobs/renesas-electronics-principal-package-design-engineer-4/

## About the role

• Strong understanding of power SiP/modules which has an substrate or embedded die/capacitor, assembly process knowledge, qualification methods, SPC and statistical analysis software. Knowledge of Cu FSM/BGBM technologies a plus. Are you ready to join our team and shape the future with us? Found on 1752vc Careers, the job board for startup and VC roles.

## What they're looking for

- Doctorate/Masters / Bachelor’s Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering
- 10-15 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip LGA packaging
- Strong understanding of power SiP/modules which has an substrate or embedded die/capacitor, assembly process knowledge, qualification methods, SPC and statistical analysis software. Knowledge of Cu FSM/BGBM technologies a plus
- Strong interpersonal and communication skills
- Strong analytical and presentation skills


Source: 1752vc Careers, https://www.1752.vc/careers/jobs/renesas-electronics-principal-package-design-engineer-4/