# Principal Package Design Engineering at Renesas Electronics

- Company: Renesas Electronics
- What the company does: Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial,...
- Company website: https://www.renesas.com
- Type: Startups
- Level: Principal and up
- Location: Plano, TX
- Work setup: On-site
- Posted: 2026-10-21
- Apply by: 2026-12-05
- Apply: https://jobs.smartrecruiters.com/RenesasElectronics/744000156854309?utm_source=1752vc&utm_medium=careers
- Page: https://www.1752.vc/careers/jobs/renesas-electronics-principal-package-design-engineering/

## About the role

• Strong understanding of power SiP/modules which has an substrate or embedded die/capacitor, assembly process knowledge, qualification methods, SPC and statistical analysis software. Knowledge of Cu FSM/BGBM technologies a plus. Are you ready to join our team and shape the future with us? Found on 1752vc Careers, the job board for startup and VC roles.

## What they're looking for

- Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, flip-chip LGA, multi-chip module with substrate or embedded die/capacitor and power device packaging
- Package technologies qualification for consumer & industrial power as well as automotive power applications
- Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM)
- Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec
- Work with Product groups and Reliability team, qualify new packages and processes within required time frame
- Resolve all process integration issues by ensuring all window checks are done on critical process steps


Source: 1752vc Careers, https://www.1752.vc/careers/jobs/renesas-electronics-principal-package-design-engineering/