# Semiconductor Assembly Process Development Engineer at Renesas Electronics

- Company: Renesas Electronics
- What the company does: Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial,...
- Company website: https://www.renesas.com
- Type: Startups
- Level: Mid level
- Location: Nakatsu, JP
- Work setup: On-site
- Posted: 2026-09-25
- Apply by: 2026-11-09
- Apply: https://jobs.smartrecruiters.com/RenesasElectronics/744000151752389
- Page: https://www.1752.vc/careers/jobs/renesas-electronics-semiconductor-assembly-process-development-engineer/

## About the role

This role offers the opportunity to work at the forefront of innovation—developing high-density, high-heat-dissipation packages for AI/HPC, as well as high-reliability solutions for automotive and IoT applications—and to contribute to technologies that underpin transformative advancements such as AI and autonomous driving. You will be responsible for technology development in semiconductor back-end processes, including assembly, packaging, and testing:

## What they're looking for

- Development and evaluation of advanced packaging technologies, including FCCSP and FCBGA
- Material and process development, as well as improvement of assembly processes (e.g., molding, strip grinding, ball mounting, marking, and package sawing)
- Support for production line setup and transition to mass production
- Driving process quality improvements and yield enhancement activities
- Minimum of 5 years of experience in technology development for semiconductor back-end processes (assembly and packaging)
- At least 5 years of experience in technology development in one or more of the following processes: Molding, Strip Grinding, or Package Sawing


Source: 1752vc Careers, https://www.1752.vc/careers/jobs/renesas-electronics-semiconductor-assembly-process-development-engineer/