# Semiconductor Assembly Process Technology Development Engineer at Renesas Electronics

- Company: Renesas Electronics
- What the company does: Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial,...
- Company website: https://www.renesas.com
- Type: Startups
- Level: Mid level
- Location: Nakatsu, JP
- Work setup: On-site
- Posted: 2026-10-22
- Apply by: 2026-12-06
- Apply: https://jobs.smartrecruiters.com/RenesasElectronics/744000157043769?utm_source=1752vc&utm_medium=careers
- Page: https://www.1752.vc/careers/jobs/renesas-electronics-semiconductor-assembly-process-technology-development-engine/

## About the role

You will be responsible for technology development tasks in the assembly and packaging of advanced semiconductor packages for AI, HPC (High Performance Computing), automotive, and IoT advanced semiconductor packages (such as Flip Chip Scale Package, Flip Chip Ball Grid Array, and Power Semiconductor Package). Found on 1752vc Careers, the job board for startup and VC roles.

## What they're looking for

- Over 5 years of experience in technology development in semiconductor back-end processes (assembly and packaging)
- Over 5 years of technical development experience in any of the processes of Ball Mount, Reflow, Flux cleaning, or Marking
- Practical experience in process improvement, quality control, and equipment introduction
- Technical degrees (mechanical, materials, electronics, chemistry, etc.)
- Business-level proficiency in both Japanese and English
- Practical experience in analyzing and improving defects using FTA, 5 Whys, etc. in subsequent processes


Source: 1752vc Careers, https://www.1752.vc/careers/jobs/renesas-electronics-semiconductor-assembly-process-technology-development-engine/