# Senior Director, Package Design Engineering at Renesas Electronics

- Company: Renesas Electronics
- What the company does: Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial,...
- Company website: https://www.renesas.com
- Type: Startups
- Level: Principal and up
- Location: Austin, TEXAS
- Work setup: On-site
- Posted: 2026-09-27
- Apply by: 2026-11-11
- Apply: https://jobs.smartrecruiters.com/RenesasElectronics/744000152038869
- Page: https://www.1752.vc/careers/jobs/renesas-electronics-senior-director-package-design-engineering/

## About the role

The Sr. Director, Technical Program Management will lead a global technical program management organization responsible for driving execution of strategic AI/Datacenter Infrastructure Power package engineering and new product introduction (NPI) programs.

## What they're looking for

- QUALIFICATIONS
- Doctorate, Master’s, or Bachelor’s Degree in Electrical Engineering, Materials Science, Physics, Chemistry, or a related technical discipline
- 15–20+ years of relevant experience in semiconductor engineering, product development, applications, package development, NPI, manufacturing, technical program management, or a closely related field
- Demonstrated experience leading complex semiconductor NPI programs involving package development, assembly, qualification, reliability, and manufacturing ramp
- Strong understanding of semiconductor product development process, package and assembly processes
- Experience in Power Management products, particularly power SiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, battery management system, PMICs, wafer-level and/or flip-chip technologies