# Senior Staff NPI Packaging Engineer at Renesas Electronics

- Company: Renesas Electronics
- What the company does: The Senior Packaging NPI Staff Engineer is responsible for leading Wafer-Level Chip-Scale Package (WLCSP) new product introduction activities from development through volume production.
- Company website: https://www.renesas.com
- Type: Startups
- Level: Senior
- Location: Zhubei, TW
- Work setup: On-site
- Posted: 2026-10-22
- Apply by: 2026-12-06
- Apply: https://jobs.smartrecruiters.com/RenesasElectronics/744000157071365?utm_source=1752vc&utm_medium=careers
- Page: https://www.1752.vc/careers/jobs/renesas-electronics-senior-staff-npi-packaging-engineer/

## About the role

Are you ready to join our team and shape the future with us? Found on 1752vc Careers, the job board for startup and VC roles.

## What they're looking for

- Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or related field
- Typically 10+ years of experience in semiconductor packaging, with strong focus on WLCSP and board-level reliability
- Prior experience in NPI, package engineering, or customer-facing technical roles preferred


Source: 1752vc Careers, https://www.1752.vc/careers/jobs/renesas-electronics-senior-staff-npi-packaging-engineer/