# Staff Package Design Engineer at Renesas Electronics

- Company: Renesas Electronics
- What the company does: Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial,...
- Company website: https://www.renesas.com
- Type: Startups
- Level: Senior
- Location: Bayan Lepas, MY
- Work setup: On-site
- Posted: 2026-10-07
- Apply by: 2026-11-21
- Apply: https://jobs.smartrecruiters.com/RenesasElectronics/744000154006459?utm_source=1752vc&utm_medium=careers
- Page: https://www.1752.vc/careers/jobs/renesas-electronics-staff-package-design-engineer-2/

## About the role

We are actively advancing technological innovation in the semiconductor package assembly, with a focus on next generation packaging technologies such as PowerQFN, Flip-Chip, and SiP. In particular, the fields of AI, High Performance Computing (HPC), and Vertical Power Delivery (VPD) are rapidly increasing their demand for higher density, higher reliability, and high thermal dissipation package technologies. Found on 1752vc Careers, the job board for startup and VC roles.

## What they're looking for

- Masters / Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering
- 5-15 years of relevant experience in package development emphasizing leadframe, laminate, power QFN/SiP/module, flip-chip packaging, and wafer Front-Side (FSM) / Back-Side (BM) Metallization processing
- Strong interpersonal and communication skills
- Strong analytical and presentation skills


Source: 1752vc Careers, https://www.1752.vc/careers/jobs/renesas-electronics-staff-package-design-engineer-2/