# Staff Package Design Engineer at Renesas Electronics

- Company: Renesas Electronics
- What the company does: Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial,...
- Company website: https://www.renesas.com
- Type: Startups
- Level: Senior
- Location: Tempe, Arizona
- Work setup: On-site
- Posted: 2026-11-04
- Apply by: 2026-12-19
- Apply: https://jobs.smartrecruiters.com/RenesasElectronics/744000159540279?utm_source=1752vc&utm_medium=careers
- Page: https://www.1752.vc/careers/jobs/renesas-electronics-staff-package-design-engineer-3/

## About the role

In this role, you will work at the intersection of IC design, advanced package development, and system-level implementation. As a Staff-level contributor, you will serve as the technical focal point, guiding the architecture and physical design of next-generation, high-performance semiconductor packages, including 2.5D/3D heterogeneous integration, chiplet-based architectures, high-density interposers, and advanced substrate technologies. Found on 1752vc Careers, the job board for startup and VC roles.

## What they're looking for

- Advanced Packaging Expertise: Strong background in advanced substrate-based packages, flip-chip layout, multi-die/chiplet-based architectures, thermal mitigation, and high-density routing
- CAD Proficiency: High proficiency with industry-standard package design tools, specifically Siemens/Mentor Xpedition (Layout / Substrate Integrator), Valor NPI, and/or Cadence Allegro Package Designer / SiP Layout
- Cross-Disciplinary Acumen: Working understanding of SI/PI fundamentals, impedance control, crosstalk mitigation, and the ability to balance these constraints against pin budgets and platform integration requirements


Source: 1752vc Careers, https://www.1752.vc/careers/jobs/renesas-electronics-staff-package-design-engineer-3/