# Advanced Package Design Engineer at SK Hynix

- Company: SK Hynix
- Company website: https://www.skhynix.com
- Type: Startups
- Level: Mid level
- Location: San Jose, CA
- Work setup: On-site
- Posted: 2026-02-11
- Apply by: 2026-10-12
- Apply: https://job-boards.greenhouse.io/skhynixamerica/jobs/5117958008
- Page: https://www.1752.vc/careers/jobs/sk-hynix-advanced-package-design-engineer/

## About the role

We are seeking a skilled Advanced Package Design Engineer to join our Packaging Engineering team in SK Hynix America. You will be responsible for designing and optimizing high-performance, high-density Interposers for chiplet-based architectures and heterogeneous integration solutions. You’ll collaborate closely with PCB, SI/PI, thermal, and manufacturing teams to deliver robust, manufacturable, and cost-effective package solutions

## What they're looking for

- Bachelor’s or Master’s degree in Electrical Engineering (Preferred), Mechanical Engineering, Material Science, or a related field
- 3+ years of experience in semiconductor package design or layout
- Proven experience with layout tools Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition
- Understanding of high-speed signal routing, power distribution networks (PDN)
- Familiar with 2.5D/3D packaging technologies, substrate design rules, and large body substrate technologies
- Effective communication skills and ability to work in a fast-paced, cross-functional environment

Tags: PKG Engineering