Broadcom delivers semiconductors and infrastructure software for global enterprises’ most complex, mission-critical needs.
About the role
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More about this role
1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)
2. If you already have a Candidate Account, please Sign-In before you apply.
As part of WW ASIC product development team, this individual will work closely with silicon & package design, marketing, NPI, assembly/substrate suppliers & customers and is responsible for developing cost effective high performance, advanced custom package solutions achieving signal integrity, thermal, structural reliability, substrate fab/package assembly design rules & project schedule requirements. • 2.5D & 3D is cutting edge package technology with BRCM’s needs pushing the technology limits.
Job Scope (Advanced Package Technology Engineer)
– Provide deeper expertise in 2.5D / 3D technology ; current and future customer engagement on technology needs & updates, consolidation of requirements and drive towards unified solution.
– Lead in identification, development & qualification; program management with external assembly partners
– Lead in memory supplier(s) engagement to define technology and quality requirements.
– Interface with other technical teams (DI, Pkg...
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