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FBAR Filter Designer

Broadcom · USA-California- San Jose - 1730 Fox Drive · On-site

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About Broadcom

Broadcom delivers semiconductors and infrastructure software for global enterprises’ most complex, mission-critical needs.

About the role

We are seeking an FBAR Filter Designer to lead the development of high-performance RF Front-End (RFFE) solutions. You will own the design lifecycle—from acoustic resonator synthesis to full module integration —bridging the gap between die-level physics and system-level hardware for 5G and Wi-Fi standards.

What they're looking for

  • Acoustic/RF/Microwave Expertise: Deep understanding of FBAR/BAW/SAW physics or extensive experience in RFFE module integration and RF/microwave circuit theory
  • Simulation Mastery: Expert proficiency in ADS and 3D EM tools (e.g., HFSS , CST , or Sonnet )
  • System Knowledge: Strong grasp of RFFE architectures, including carrier aggregation and coexistence specifications
  • Communication: Excellent verbal and written skills, ability to explain complex technical trade-offs to cross-functional teams and stakeholders
  • PhD (EE/Physics) with 3 + years experience OR Master’s with 7 + years experience in RF/Microwave design (Acoustic Filter or RFFE Module)
  • Proven track record of successful tape-outs or high-volume product releases
More about this role

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We are seeking an FBAR Filter Designer to lead the development of high-performance RF Front-End (RFFE) solutions. You will own the design lifecycle—from acoustic resonator synthesis to full module integration —bridging the gap between die-level physics and system-level hardware for 5G and Wi-Fi standards.

  • Design & Synthesis: Design high-Q FBAR filters and multiplexers using optimized topologies.
  • Layout & Floor Planning: Own the physical die layout and package integration, optimizing for parasitics and thermal dissipation.
  • Module Co-Design: Manage the interface between acoustic die, laminate, and PCB to ensure signal integrity and target performance.
  • EM Co-Simulation: Lead 3D EM simulations to model package-level parasitics, interconnects, and coupling.
  • Yield & Verification: Perform Monte Carlo and corner analyses to ensure robust performance for high-volume manufacturing (HVM).
  • Collaboration: Partner with process, modeling, test, module, and other design...

Read the full posting on Broadcom's site ↗

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