Broadcom delivers semiconductors and infrastructure software for global enterprises’ most complex, mission-critical needs.
About the role
Overall design responsibility for ASIC package designs, including aspects of signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts. Package Design of critical structures for SerDes, ADC/DAC, DDR, etc.
What they're looking for
- BSEE or similar field and 2+ years’ experience in flip-chip-BGA package design, including high-speed SerDes or MSEE or PhD
- Knowledge of electrical engineering fundamentals
- Preferred candidates have a working knowledge of package-level signal integrity and power integrity, to apply to package designs
- Cadence APD (allegro package designer) experience is preferred. Equivalent layout tool is OK
- Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers
- Self-management and organization skills
More about this role
1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)
2. If you already have a Candidate Account, please Sign-In before you apply.
Broadcom is seeking an IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 224G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design, and contribute to efficiency improvements for our design team.
Overall design responsibility for ASIC package designs, including aspects of signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.
Package Design of critical structures for SerDes, ADC/DAC, DDR, etc.
Schedule, prioritize, & track your work...
Browse similar: Startup jobs