Density shows you how people use your space and helps you get more out of every square foot. Backed by Kleiner Perkins and South Park Commons.
About the role
Own the board-level physical design that turns our accelerator silicon into systems. You'll take high-speed, high-power designs from placement through fabrication release — defining stackups, escaping large fine-pitch BGAs, routing multi-hundred-amp power delivery, and holding the constraint discipline that lets a channel close margin in the lab and not just in simulation.
What they're looking for
- 8+ years of PCB layout experience on server, networking, or accelerator-class systems at high layer counts
- Hands-on with industry-standard layout tools (Cadence Allegro, Siemens Xpedition, Altium, or equivalent) and release formats (Gerber, ODB++, IPC-2581)
- Demonstrated ability to work closely with signal-integrity, power-integrity, packaging, and hardware systems teams to implement and close complex constraint sets across package and board
- (Optional) 2.5D / 3D and multi-die package interfaces (CoWoS, EMIB, chiplets, HBM), rigid-flex or backplane design, CAD automation scripting, IPC CID / CID+, or overseas PCB fabrication and PCBA partner management
More about this role
Own the board-level physical design that turns our accelerator silicon into systems. You'll take high-speed, high-power designs from placement through fabrication release — defining stackups, escaping large fine-pitch BGAs, routing multi-hundred-amp power delivery, and holding the constraint discipline that lets a channel close margin in the lab and not just in simulation. You'll work at the seam where the package meets the system, partnering with signal and power integrity, packaging, and hardware systems, and directly with the fabrication and assembly partners who build what you release. When a board comes back and something doesn't behave, you're one of the people who knows why.
- Own board-level physical design for the systems our AI accelerators ship in stackup and impedance definition, placement, high-speed routing, and fabrication and assembly release packages
- Own high-current power delivery layout and large fine-pitch BGA escape for advanced accelerator packages
- Drive DFM/DFA with PCB fabrication and contract manufacturing partners, and support board bring-up and debug
- Use and develop AI assisted tool flows to accelerate layout, review, and design-rule checking
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