Density shows you how people use your space and helps you get more out of every square foot. Backed by Kleiner Perkins and South Park Commons.
About the role
Own the signal-integrity and power-integrity engineering that keeps our AI accelerator running clean — across die, package, and board. You'll model and sign off the high-speed interface channels and power-delivery networks that move data and power through the system, set the SI/PI budgets the design is built to, and partner closely with the package, PCB, physical-design, and architecture teams to meet them.
What they're looking for
- Exceptional abilities across SI/PI analysis: link budgeting, channel modeling and S-parameter extraction, IBIS-AMI, IR-drop and power-delivery-network (PDN) analysis, and EM/thermal-aware signoff
- 5+ years of SI/PI experience on very high-performance designs at advanced technology nodes (7nm or better) and high-speed interfaces (PCIe, DDR/LPDDR, HBM, 112G+ SerDes, or equivalent)
- Hands-on with industry-standard tools (Ansys HFSS / SIwave / RedHawk, Cadence Sigrity / Clarity, Synopsys, Keysight ADS or equivalent) for extraction, EM, and PDN analysis
- Demonstrated ability to work closely with package, PCB, physical design, and architecture teams to set and sign off SI/PI budgets across die–package–board
- (Optional) 2.5D / 3D and multi-die packaging (CoWoS, EMIB, chiplets, HBM interfaces), jitter / equalization design, co-packaged optics, or post-silicon SI/PI correlation and lab validation
More about this role
Own the signal-integrity and power-integrity engineering that keeps our AI accelerator running clean — across die, package, and board. You'll model and sign off the high-speed interface channels and power-delivery networks that move data and power through the system, set the SI/PI budgets the design is built to, and partner closely with the package, PCB, physical-design, and architecture teams to meet them. This is a deep-expertise, signoff-owning role at the intersection of high-speed design and power delivery: where the electrical realities of advanced-node, high-bandwidth silicon collide with aggressive performance targets, your analysis is what gives the team the confidence to tape out and build.
- Own signal-integrity and power-integrity analysis and signoff for DensityAI’s AI platform across silicon, package, board, and system — high-speed interface channels, power delivery, and decoupling strategy
- Use and develop AI assisted tool flows to accelerate SI/PI modeling, extraction, and signoff timelines
- Exceptional abilities across SI/PI analysis: link budgeting, channel modeling and S-parameter extraction, IBIS-AMI, IR-drop and power-delivery-network (PDN) analysis, and...
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