Co-designed chips, racks, and software to push the pareto frontier to best-in-class throughput and interactivity. Backed by Kleiner Perkins and Sequoia.
About the role
As a Signal & Power Integrity Engineer you will be responsible for the electrical performance of our AI accelerator platform across silicon, package, and board. The ideal candidate will have extensive experience with high-power package and board designs, robust power delivery networks, and high-speed signaling solutions in advanced packaging. You will work closely with silicon, package, platform, and system teams to co-design world-class platforms with OSAT and ODM partners.
What they're looking for
- Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related field with a strong understanding of signal integrity and power integrity concepts and fundamentals
- 8+ years of SI/PI experience on high-performance ASIC, processor, or accelerator platforms
- Proven experience defining and closing PDN for high-power silicon, including substrate and PCB plane design, decap strategy, and dynamic IR/EM analysis
- Experience with developing systems with high-speed interfaces like HBM, SerDes and D2D interfaces
- Hands-on expertise with one or more of: ANSYS HFSS / SIwave, Cadence Sigrity (PowerSI / PowerDC), Keysight ADS
- Experience with CoWoS or equivalent advanced packaging materials and technologies including interposer SI/PI implications, C4 bump planning, and substrate stack-up trade-offs
More about this role
Etched is building hardware for frontier intelligence. We co-design chips, racks, software, and manufacturing to deliver best-in-class throughput and latency across both prefill and decode workloads. Our first products are heavily focused on inference . Backed by hundreds of millions from top-tier investors and staffed by leading engineers, Etched is redefining the infrastructure layer for the fastest growing industry in history.
As a Signal & Power Integrity Engineer you will be responsible for the electrical performance of our AI accelerator platform across silicon, package, and board. The ideal candidate will have extensive experience with high-power package and board designs, robust power delivery networks, and high-speed signaling solutions in advanced packaging. You will work closely with silicon, package, platform, and system teams to co-design world-class platforms with OSAT and ODM partners. Intense focus on pushing what is possible in power delivery and high-speed signaling for our silicon.
SI/PI analysis of designs and optimization within 2D/2.5D/3D packages
Close interaction with Package Layout Designers, ASIC PD and IP teams as well as Board Schematic/Layout/SI/PI...
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