fab2 builds the hardware and software needed to make chips, fabs, tools, and components. Backed by Eclipse Ventures.
About the role
Design and iterate on machines and subsystems for semiconductor packaging fabrication, such as laser ablation machines, reflow ovens, and automated metal plating facilities Integrate mechanical, electrical, and optical components in system assembly, including wiring, optics alignment, and electronics
What they're looking for
- Pursuing a Bachelor’s Degree or higher in engineering
- At least 1-2 hands-on wet lab or lab-adjacent experiences, ideally in metal plating work or fabricating devices
- Strong foundation in mechanical engineering (Solidworks/Onshape, materials selection, etc.)
- Hands-on prototyping experience and the ability to move through design cycles quickly
More about this role
The fab2 team can build anything. We design all the hardware and software needed to make chips and we make the fabs, tools, and components ourselves.
We're looking for exceptional, hands-on people who can iterate to the limits of what's possible.
fab2 was founded by Sam Zeloof and Jim Keller . Sam is best known for making chips in his garage, and Jim has been a leader in the semiconductor industry for the past 40 years.
About the Role
We’re hiring Semiconductor Packaging Engineering Interns for the summer term. The internship begins in May or June, with a preferred commitment of 4 to 8 months. We are a small team engaged in end-to-end process development and integration work for semiconductor packaging processes, providing exposure to interesting work that is hard to find at larger companies. This is a hands-on engineering role—meaning you will be actively involved in the research and development of new packaging technologies, including mechanical prototyping, experiment design, and data analysis. We train our interns on most of our tools and allow them to use these tools independently, including 3d printing, metal plating, lasering, and metrology.
Our philosophy is to get things...
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