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Intel Foundry Module Development Engineer – Advanced Wet Etch and Cleans

LightLogic · US, Oregon, Hillsboro · On-site

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About LightLogic

Deliver AI at scale across cloud, data center, edge, and client with comprehensive hardware and software solutions. Backed by Lightspeed.

About the role

As a Wet Etch Module Development Engineer, you will operate at the intersection of fundamental chemical kinetics, interfacial surface science, and high-volume manufacturing engineering. You will pioneer atomic-layer selective etching, nanoscale surface cleans, supercritical and surface-tension-engineered drying, wet chemical formulations, and advanced single-wafer wet tool architectures to define the future of global computing. Found on 1752vc Careers, the job board for startup and VC roles.

What they're looking for

  • Hands-on experience with advanced thin-film, surface, and chemical characterization techniques (e.g., Ellipsometry, AFM, SEM/TEM, XPS, contact angle goniometry, FTIR, TXRF, or ICP-MS)
  • Experience with automated fluidic systems, wet processing instrumentation design, single-wafer spin hardware, or experimental fluid dynamics/mass-transfer troubleshooting
  • Demonstrated experience utilizing Python, MATLAB, JMP, or Machine Learning for design of experiments (DOE), multivariate statistical analysis, or process automation
  • Strong publication record, conference presentations, or filed patent applications demonstrating systematic problem-solving in experimental chemical and materials science
More about this role

Shape the Atomic Frontier of Semiconductor Innovation

At Intel Foundry Technology and Development (TD), we don't just participate in technology development; we engineer physical reality at the angstrom scale. We are seeking visionary, research-driven Ph.D. graduates in Chemical Engineering, Chemistry, Materials Science, Electrochemistry, and Engineering to spearhead the next breakthrough in semiconductor manufacturing.

As a Wet Etch Module Development Engineer, you will operate at the intersection of fundamental chemical kinetics, interfacial surface science, and high-volume manufacturing engineering. You will pioneer atomic-layer selective etching, nanoscale surface cleans, supercritical and surface-tension-engineered drying, wet chemical formulations, and advanced single-wafer wet tool architectures to define the future of global computing.

  • Pioneer Next-Gen Process Architectures: Formulate and execute rigorous Design of Experiments (DOE) to invent, characterize, and validate novel wet etch, selective removal, and advanced chemical clean processes that power world-class transistor architectures (RibbonFET/GAA), backside power delivery networks (PowerVia), and high-density...

Read the full posting on LightLogic's site ↗

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