We make the best chips physically possible for the large model needs of frontier labs.
About the role
Own mechanical design of AI compute trays, rack enclosures, and full rack-scale systems from concept through production, built to OCP standards — covering structural design, sheet metal, extrusions, castings, and rack-level integration. Direct mechanical engineers on 3D models and 2D drawings for every component and assembly (DFMA-based datum schemes), and run tolerance stack-ups to define IQC, IPQC, and OQC criteria across EVT, DVT, and PVT.
What they're looking for
- 15+ years of mechanical engineering experience in server, data center, or AI compute hardware, with hands-on experience designing mechanical components, sub-assemblies, and assemblies at the tray and rack level
- Experience leading mechanical teams to design rack-scale hardware: compute trays, rack enclosures, or server platforms delivered to OCP Open Rack standards
- Experience in volumetric analysis, stack tolerance analysis, and FEA analysis
- Experience integrating liquid cooling systems (cold plates, manifolds, CDU interfaces) into the whole architecture
- Experience generating DFMA with sheet metal, extrusion, casting, and machining manufacturing processes
- Experience in sustainable manufacturing compliance, and design of fixtures and test setups for multiple applications (in-process testing, reliability testing, functional testing)
More about this role
MatX is building next-generation AI compute infrastructure purpose-built for large-scale LLM training and inference. We are looking for a Mechanical Engineering Lead to own the mechanical design, thermal architecture, and system integration of our rack-scale AI platform from concept through production. This is a hands-on leadership role. You will drive the mechanical design of our AI compute trays, ORV3/ORW rack systems, and fully liquid-cooled infrastructure, working closely with hardware, thermal, electrical, and JDM/ODM partners to bring a world-class AI data center platform to life.
Own mechanical design of AI compute trays, rack enclosures, and full rack-scale systems from concept through production, built to OCP standards — covering structural design, sheet metal, extrusions, castings, and rack-level integration.
Direct mechanical engineers on 3D models and 2D drawings for every component and assembly (DFMA-based datum schemes), and run tolerance stack-ups to define IQC, IPQC, and OQC criteria across EVT, DVT, and PVT.
Own rack-level integration (power distribution, cable management, blind-mate connectors, backplane interface, tray insertion/extraction) and packaging design,...
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