Micron is a global leader in memory and storage, powering AI and compute-intensive applications from cloud to edge with innovative semiconductor solutions.
About the role
As a Process Integration Lead for Advanced Packaging, you will lead a team focused on developing and integrating advanced packaging technologies from concept through full-scale manufacturing. This role plays a critical part in enabling high-performance multi-die solutions by driving technology development, process integration, technology transfer, and collaborative execution. You will help shape the roadmap for next-generation packaging platforms while mentoring a highly skilled technical team.
What they're looking for
- Bachelor’s degree in Materials Engineering, Chemical Engineering, or a related field with 15+ years of experience to include advanced packaging technology development, 2.5D, 3D stacking, and HBM integration
- Experience with advanced interconnects, TSVs, die stacking, underfill, molding, bonding, and package integration processes
- Experience with hybrid bonding integration (W2W/C2W) and HBM-to-logic integration, including thermal optimization
- Experience defining AI-enabled engineering workflows, developing automation agents, or applying AI tools to semiconductor development
- Experience leading collaborative technical teams and driving complex engineering programs to completion
More about this role
Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
We are advancing the future of semiconductor packaging through innovative 2.5D, 3D, and heterogeneous integration technologies. Our team develops the processes that enable next-generation AI and high-performance computing products, working across materials, device, design, manufacturing, and test engineering to solve complex technical challenges. If you're excited by emerging packaging architectures and breakthrough integration approaches, you'll find meaningful opportunities to make an impact here.
As a Process Integration Lead for Advanced Packaging, you will lead a team focused on developing and integrating advanced packaging technologies from concept through full-scale manufacturing. This role plays a critical part in enabling high-performance multi-die solutions by driving technology development, process integration, technology transfer, and collaborative execution. You will...
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