Micron is a global leader in memory and storage, powering AI and compute-intensive applications from cloud to edge with innovative semiconductor solutions.
About the role
As a Principal Process Engineer in Hybrid and Fusion Die Bonding, you will provide technical leadership in the startup, development, qualification, and optimization of advanced die-bonding processes for next-generation semiconductor products. You will apply deep process expertise and data-driven problem solving to improve product quality and reliability, accelerate yield learning, reduce cost, increase productivity, mitigate technical and manufacturing risk, and resolve complex production-line challenges.
What they're looking for
- A BS degree with minimum 8+ years proven experience in Semiconductor Process Engineering
- Solid engineering knowledge of semiconductor advanced packaging die stacking processes
- Skilled at designing valid tests and Design of Experiments (DOE)
- Excellent data collection, organization, and analysis skills, plus proficiency in data analysis techniques/programs
- Knowledge and an understanding of project management and experience leveraging AI to design experiments
More about this role
Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry.
As a Principal Process Engineer in Hybrid and Fusion Die Bonding, you will provide technical leadership in the startup, development, qualification, and optimization of advanced die-bonding processes for next-generation...
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