Micron is a global leader in memory and storage, powering AI and compute-intensive applications from cloud to edge with innovative semiconductor solutions.
About the role
As a Senior Materials Engineer / Scientist in Advanced Packaging Technology Development (APTD), you will help define and enable the materials foundation for Micron's next-generation memory and advanced packaging technologies, including HBM, 3D memory, and heterogeneous integration. You will find, develop, characterize, qualify, and integrate new materials that make new product architectures possible. You'll also improve performance, reliability, manufacturability, scalability, and cost. Found on 1752vc Careers, the job board for startup and VC roles.
What they're looking for
- MS or PhD in Materials Science and Engineering, Chemical Engineering, Chemistry, Polymer Science, Physics, Mechanical Engineering with a strong materials focus, or a closely related field
- Professional or research experience developing, characterizing, qualifying, integrating, or scaling advanced materials technologies
- Strong materials science fundamentals, including structure–property–process–performance relationships
- Proven ability to solve complex, multidisciplinary technical problems through experimentation, analysis, and structured problem solving
- Clear technical communication and the ability to collaborate across disciplines, organizations, suppliers, and geographies
- Ability to work independently, build alignment, and deliver results as part of a global team
More about this role
Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As a Senior Materials Engineer / Scientist in Advanced Packaging Technology Development (APTD), you will help define and enable the materials foundation for Micron's next-generation memory and advanced packaging technologies, including HBM, 3D memory, and heterogeneous integration. You will find, develop, characterize, qualify, and integrate new materials that make new product architectures possible. You'll also improve performance, reliability, manufacturability, scalability, and cost.
You will work with materials science, process development, integration, product, manufacturing, quality, and supplier teams to turn scientific insight into technology impact. We're looking for people who question assumptions, look beyond their own field, and stay with hard, ambiguous problems until they're solved. Direct semiconductor experience is valuable but not required. We encourage candidates...
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