Backed by a16z, Kleiner Perkins and Lightspeed.
About the role
At Nexthop AI, our thermal solutions are as complex as the silicon they cool. We are looking for a Hardware Product Engineer to act as the ultimate technical authority for our Direct-to-Chip (D2C) and rack-level cooling systems. This role sits within the Hardware Design Ladder and is responsible for the physical realization of our hardware—from the initial equipment selection at the factory to the final data sign-off before a product reaches the customer.
What they're looking for
- Equipment Buyoff (FAT/SAT): Lead Factory Acceptance Testing (FAT) and Site Acceptance Testing (SAT). You own the "Buyoff" process, ensuring equipment meets precision, repeatability, and safety standards
- Thermal Validation Lead: Identify and establish the "North Star" metrics for D2C and rack-level integration. Define what we measure, how it’s captured at the factory, and why it ensures long-term survival
- NPI Milestone Leadership: Lead technical reviews for EVT/DVT/PVT milestones, ensuring all thermal exit criteria are met and documented
- L10/L11 System Integration: Define the technical requirements for integrating switch chassis into liquid-cooled racks, focusing on manifold reliability and blind-mate coupling integrity
- TIM Strategy: Define and validate Thermal Interface Material (TIM) application and compression standards to prevent pump-out and ensure decade-long thermal stability
- New Technologies : Evaluate and vet emerging cooling technologies—such as two-phase systems or advanced heat siphons—to determine technical and operational fit
More about this role
NPI Engineer, Thermal
Ladder: Hardware Design
Travel: Approximately 20%
Role Overview
At Nexthop AI, our thermal solutions are as complex as the silicon they cool. We are looking for a Hardware Product Engineer to act as the ultimate technical authority for our Direct-to-Chip (D2C) and rack-level cooling systems. This role sits within the Hardware Design Ladder and is responsible for the physical realization of our hardware—from the initial equipment selection at the factory to the final data sign-off before a product reaches the customer.
Key Responsibilities
1. Strategy, Selection & Buyoff
- Critical Vendor Portfolio: Drive our thermal solutions vendor portfolio by auditing, assessing, qualifying, and ramping each vendor and their commodity. Use technical expertise to know when a second source is critical and drive the qualification of that second source.
- Critical Equipment Roadmap: Research and determine and design the mandatory equipment list required to support NUDD (New, Unique, Different, Difficult) thermal designs (e.g., high-vacuum leak testers, precision TIM dispensers, robotic manifold assemblers).
- Equipment Buyoff (FAT/SAT): Lead Factory Acceptance Testing (FAT)...
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