Backed by CapitalG.
About the role
We are seeking a hands-on Senior Packaging Failure Analysis Engineer to lead root-cause investigation of complex failures across our silicon photonics, MEMS, optical packaging, and electronic assemblies. Found on 1752vc Careers, the job board for startup and VC roles.
What they're looking for
- BS, MS, or PhD in Materials Science, Materials Engineering, Physics, Mechanical Engineering, Chemical Engineering, or a related discipline
- 8+ years of hands-on experience in failure analysis, materials characterization, or physical analysis within semiconductors, advanced packaging, photonics, MEMS, microelectronics, or a related field
- Demonstrated expertise in cross-sectioning and analysis of bonded interfaces
- Strong knowledge of materials behavior, phase diagrams, intermetallics, interfaces, adhesion, fracture, and material interactions
- Hands-on experience with several analytical techniques such as SEM/EDS, FIB, XPS, XRD, optical microscopy, X-ray/CT, SAM, FTIR, and DSC
- Ability to select the appropriate analytical technique based on the failure mechanism being investigated and understand the strengths and limitations of each method
More about this role
nEye.ai, a well-funded optical switch startup, is poised to revolutionize the future of data centers. nEye’s MEMS-based silicon photonics optical circuit switches (OCS) eliminate critical bottlenecks in AI processing by enabling direct optical connections among thousands of GPUs and memory units. The company's SuperSwitch is an ultra-low power consumption, high radix, compact chip-scale design, offering hyperscale data centers enhanced performance, efficiency, and scalability.
We are seeking a hands-on Senior Packaging Failure Analysis Engineer to lead root-cause investigation of complex failures across our silicon photonics, MEMS, optical packaging, and electronic assemblies.
This role will have a particular focus on cross-sectioning bonded components and analyzing material interfaces, including adhesive/epoxy attach, fusion and eutectic bonding, solder interconnects, and hermetic packages. The ideal candidate combines a strong foundation in materials science and interfacial phenomena with deep practical experience in failure analysis, microscopy, analytical characterization, and sample preparation.
You will own investigations from initial non-destructive analysis through...
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