Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial,...
About the role
We are seeking an experienced Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and manufacturing execution for advanced semiconductor packaging technologies.
What they're looking for
- Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related technical discipline
- 12+ years of semiconductor manufacturing and packaging engineering experience with exposure to IC assembly operations, package development, qualification, and NPI-to-HVM transfers
- 5+ years of experience leading technical projects, coordinating engineering activities, or mentoring engineers in semiconductor manufacturing environments
- Strong understanding of semiconductor manufacturing yield analysis, SPC, DOE, reliability, process control methodologies, package/process qualification methods, and statistical analysis tools
- Experience working with global OSAT partners and outsourced manufacturing ecosystems, including qualification support and ongoing technical coordination with subcontractors and contract manufacturers
- Experience supporting NPI-to-HVM product ramp execution
More about this role
We are seeking an experienced Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, including Smart Power Stages, Vertical Power Stages, Power Modules, and Discrete FET packages, with additional exposure to wide-bandgap (WBG) technologies including SiC and GaN, DBC and AMB substrates, and advanced interconnect technologies. This position will focus on yield improvement, process stability, quality support, process change execution, and manufacturing readiness while working closely with Package Engineering, Product Engineering, Quality, Supply Chain, and external OSAT partners to support New Product Introduction (NPI) transfer into high-volume manufacturing (HVM).
The ideal candidate combines strong semiconductor packaging assembly knowledge with hands-on technical execution, structured problem solving, and cross-functional coordination skills to improve manufacturing performance, product quality, and process robustness. This role serves as a technical contributor and coordination...
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