About Renesas Electronics
Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial,...
About the role
Are you ready to join our team and shape the future with us?
What they're looking for
- Doctorate/Masters / bachelor’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering
- 5-12 years of relevant experience in package development emphasizing Power Module plastic package
- Strong interpersonal and communication skills
- Strong analytical and presentation skills
More about this role
- Design and develop Power Modules which use embedded die laminate technology with SMT of Cap and Inductor for Renesas’s packaging needs in the areas of Commercial Industrial power device packaging for servers and AI.
- Define package technologies tooling & qualification for Commercial Industrial power device packaging for servers and AI power applications.
- Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT Outsourced Semiconductor Assembly & Test).
- Work with Renesas product designers to develop detailed Power Module package drawings for plastic packages using AutoCAD.
- Work with OSAT (Outsourced Semiconductor Assembly & Test) to run DOE to optimize processes and establish process spec.
- Work with Product groups and Reliability team, qualify new packages and processes within required schedule from Product Engineer/Program manager.
- Develop and maintain technical expertise on advances and innovations Power Module plastic packages.
- Participate in packaging roadmap development & focus on execution.
- Doctorate/Masters / bachelor’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
- 5-12 years of relevant...
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