One core technology. Comms and sensing. Backed by Space Capital.
About the role
We're looking for a Senior Mechanical Engineer to own the mechanical design of our radar sensor nodes end-to-end—the array panels, enclosures and thermal systems that let a phased array survive and perform outdoors at a low cost. You'll drive designs from concept through qualification and production, working directly with our RF, antenna, and electronics teams. As an early mechanical hire, you'll have an outsized impact on how our radar systems are architected, built, and scaled.
What they're looking for
- BS in Mechanical Engineering or a related field
- 5–10 years of experience in mechanical design of electronics hardware, including at least one product taken through to production
- Demonstrated ownership of thermal design for high-power-density electronics
- Experience designing sealed, ruggedized enclosures for outdoor deployment
- Expert proficiency in 3D CAD (NX, Creo, Catia, SolidWorks, or similar)
- Expert proficiency in GD&T (ASME Y14.5)
More about this role
Roguebeam is a startup developing advanced phased array systems for communications and radar applications. We design and manufacture complete systems in-house—RF, antenna, PCB, ASIC/digital, DSP, and mechanical—giving our engineers end-to-end ownership of the technology and a direct line of sight from design to deployed system. We're early, we're growing fast, and the people who join us now will shape both the technology and the company.
We're looking for a Senior Mechanical Engineer to own the mechanical design of our radar sensor nodes end-to-end—the array panels, enclosures and thermal systems that let a phased array survive and perform outdoors at a low cost. You'll drive designs from concept through qualification and production, working directly with our RF, antenna, and electronics teams. As an early mechanical hire, you'll have an outsized impact on how our radar systems are architected, built, and scaled.
Own the mechanical design of radar sensor nodes from concept through production, including array panel structure, enclosure and mounting.
Thermal management: conduction paths from beamformer ICs and power electronics through the array panel to ambient, including heat...
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